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Services Electronics
Cooling & Thermal Management
At Hill Engineering we specialize in the thermal
aspects of electronic product design. This includes matching fans or
blowers to enclosure characteristics and thermal requirements, designing
intake and exhaust grilles and louvers and placing internal components for
optimum air flow paths. We also operate a testing laboratory to measure
air flow and thermal performance of electronic enclosures.
If you are having thermal problems with an existing product, we can work
with you to analyze your product, diagnose the problem, and recommend
solutions. Turnaround time for this service can be as little as a few
days.
To save even more time and help ensure reliability
from the start, Hill Engineering can supplement your internal engineering
staff during new product development by providing independent verification
of the mechanical and thermal portions of the design.
We have a successful track record of practical
solutions to electronic packaging and cooling problems that spans the past
20 years. We are currently serving major electronics companies
nationwide. For more information, or to have a problem solved quickly,
contact us at cs@hillengineering.com. We can usually give you a quote and
estimated delivery time the next day.
Here is a sampling of some of the services we can
provide related to electronics cooling and thermal management.
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Fan/blower selection
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System resistance curves
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Heat sink selection or design
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Construction of low-cost flow mock-ups for early
test and confirmation of cooling schemes
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ANSI S12.11 sound chamber for measurement of noise
emitted by small air-moving devices
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Acoustic testing, design to reduce acoustic noise of
systems
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Prediction of thermal performance in all types of
environments
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Correlation of CFD analysis with test results more>>
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Design of large transformers & inductors for forced air
cooling
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Prediction of temperature rise in products exposed
to solar radiation
Product Design
services>> |
